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Telecommunications 
Covega Technology from Thorlabs Quantum Electronics a part of Thorlabs, Inc. (www.thorlabs.com) offers a family of high performance, Telcordia-compliant, external optical intensity and phase modulators with industry leading long-term reliability. The intensity modulators are based on Mach-Zehnder interferometers and are fabricated using titanium diffused Lithium Niobate substrates. Our exclusive bias trimming technology allows for the operation of intensity modulators near-zero volts at any desired operating point (quadrature, maximum or minimum). This application helps the user to achieve a substantial cost saving and operability enhancement in various telecom and non-telecom system applications. Covega modulators are based on x-cut and z-cut LiNbO3 wafers and can be configured to either zero-chirp or a fixed chirp. Modulators for emerging telecom applications like duobinary modulation, dual quadrature phase shift key modulation (DQPSK), and dual binary phase shift key (DBPSK) modulation are in development and early samples are available. Manufacturing processes are controlled using six-sigma processes leading to high yields and repeatability.
The company’s Single Angle Facet (SAF) solution permits superior performance for external cavity tunable lasers by providing broad bandwidth, high power and stable operation. The enhanced functionality is achieved by using a proprietary SAF and reliable ridge waveguides. The result is a substantial cost savings for the gain chips, while maintaining peak performance versus the conventional anti-reflection coating approach.
The company's Semiconductor Optical Amplifier (SOA) line of products delivers industry-leading performance in high saturation power, large gain and low noise figure. Our SOA’s are currently used as booster, in-line and pre-amplifiers, optical switches, and for non-linear applications like the wavelength conversion and optical logic gates.
The company's Fabry-Perot lasers provide high power and can be provided in multiple packages including butterfly packages, chip-on-submounts, TO-cans headers, and bars.
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